LCD 장비

Since 1993, BOIS installed the many Full Inline LCD Production line in China, Start

from TN, HTN, STN, then to Color STN, 3D glass, ODF… such brand new technology in

each era coordinate by our technical partner and each customers was satisfied. Not

only Production line, even for the single machine we have to provide the total solution

together with materials, process and parameter confirmation know-how. In this 20 years,

BOIS was became a unique specialist company in Hong Kong and China can provide this

service.


LCD Production Process

1 Auto Loader
Input the Incoming Glass into the Cassette Special Material Cassette should be used in order to prevent dust pollution
2 Incoming Cleaner
Washing the micro particle dust by various of Chemical and Physical method such as bubble jet,Line shower and ultar sonic
3 Buffer
Temperary Stocking of Glass during trouble occurs, when receive the I/O signal command of glass stocking will control thur the CPU before the glass reach the limit
4 Photo resist Coater
Coating of Photoresist layer, two coating method Spin Coat and Roller Coat is popular. Thickness of 1.2umT layer should coat on the glass surface
5 Pre Bake Conveyor
Pre Bake of Photoresist Layer, Most baling method is Hot Plate method, Heater is under the glass prevent uneven shape generate on the surface of the materials, we call the process levelling
6 Exposure
Exposure of Pattern by UV Light Thur the Mask, Because Lamp will generate the heat caused Mask exspansion, therm-Control system is necessary, also Mask changer is an option
7 Unloader
Collect the Glass and ready for Line Check, Usually checking at Yellow Zone
8 Loader
Glass inside Cassette ready for sheet by sheet production, at that time already selected the glass is F sheet or R sheet.
9 Development
Develop process for the resist process. Some development liquid generate lots of bubbles Anti-bubble system is essential and special nozzel should be designed.
10 Post Bake Conveyor
Pure Cure for Resist layer ,Hot plate conveyor is popular for this process The Heat conduction should be from bottom to top prevent irregualr shape on the layer.
11 Etching
ITO Terminal Etching process, some chemical such as Fe2Cl3 will be used, at that case Heat resistance constrcution should be used in machine.Machine length depends by the concerntration of the etching materials.
12 Stripping
Stripping of Unnecessary ITO layer, Discompose or Non Decompose type stripping liquid may be used Speical filter system should be use if non de-compose liquid was used.
13 Unloader
Collect of Glass after stripping process , NG product will move to Laser Repair in order check for leakage of terminal, short conductive reach between 2 lines or other pollution avaliable or not
14 Loader
Glass inside Cassette ready for sheet by sheet production Special Material Cassette should be used in order to prevent dust pollution
15 Pre Cleaning before Top Coating
Pre Cleaning fo the Glass thur Chemical and Phyiscal method, SiO2 is the most common resistance layer Brush washing method, pulse jet and US method can be used. In order for easy printing UV light will be used for reduce surface contact angle under 10м
16 Top Coating
Printing of SiO2 Layer, Using APR plate for printing ,Doctor roll method andDoctor plate method can be used Cell will print under the pattern of APR plate
17 Pre Bake Furnace
PreCure of SiO2 Layer, Hot plate method is usually use fpr pre-cure, sometimes will use the oven Tempeture setting depends on the specifiaction of the Top Coat materials
18 UV Curing
UV Cure of SiO2 Layer, usually two types 3000mj/cm2 and 6000mj/cm2 will be used Because of the high temperture High power Cool down system should be used for UV chamber
19 Post Bake Furnace
Post Cure of SiO2 Layer by High temperture, hot plate method is popular but sometime will use Oven for Curing( Glass put inside the high temperature resist Cassette) and Curing
20 Loader
Upper Lower Glass inside Cassette ready for sheet by sheet production Special Material Cassette should be used in order to prevent dust pollution
21 Pre Cleaning before P.I Coating
Pre Cleaning fo the Glass thur Chemical and Phyiscal method Brush washing method, pulse jet and US method can be used. In order for easy printing UV light will be used for reduce surface contact angle under 10м
22 P.I Coating
Printing of P.I Layer, Using APR plate for printing ,Doctor roll method andDoctor plate method can be used Cell will print under the pattern of APR plate
23 Pre Bake Conveyor
PreCure of P.I Layer, Hot plate method is usually use fpr pre-cure, sometimes will use the oven Tempeture setting depends on the specifiaction of the P.I Coat materials ,thickness of P.I around 600AЭ800Aм
24 Post Bake Conveyor
Post Cure of P.I Layer by High temperture, hot plate method is popular but sometime will use Oven for Curing( Glass put inside the high temperature resist Cassette) and Curing
25 Loader
Upper Lower Glass inside Cassette ready for sheet by sheet production. Special Material Cassette should be used in order to prevent dust pollution.
26 US Dry Cleaner
Discompose the dust stick on the glass, using ultrasonic to generate the vacuum stuck the dust. Dry method is popular is this process.
27 Rubbing
Rubbing process for lining up the liquid crystal, in order prevent electrostatic, X-Ray Showering and Ceramic stage will use. If use X-Ray shower 5mm thickness OVC covering should be used.
28 US Dry Cleaner
Remove the Rubbing Cloth dust on the glass, using ultrasonic to generate the vacuum stuck the dust. Dry method is popular is this process.
29 UnLoader
Collect of Glass, This line is called Assembly line ,at this moment F Cassette and R Cassette should be divided.
30 Loader
Glass inside Cassette ready for sheet by sheet production Special Material Cassette should be used in order to prevent dust pollution.
31 Separate Conveyor
Divide F and R Glass to Seal and Ag printing process. ITO mark will be prepared for F and R glass Special sensor touch the ITO and indicate the glass belongs to F or R.
32 After Rubbing Cleaning
Remove the Rubbing Cloth dust on the glass by liquid, this is the wet method, usually I.P.A will be use for washing howver I.P.A concentration is too high may cause exposion,Anti-exposion constrcution may be necssary
33 Screen Printer Ag, Seal
Print the seal and paste on the glass, Screen Frame should have an alighment use for ITO glass alignment ,after CCD catch the mark printing can be process.
34 Pre Bake Conveyor
Pre Cure of Ag paste and Seal on the glass, Heat should be from the upper side to the lower side maintain the shape and the thickness of the seal and paste.IR or Themo Oven usally use in this process
35 Spacer Sprayer
Spacer Spray on the glass, Dry type Spray and wet type spray is necessary, dry type use electro-static for spacer distribution. Semi Dry type using IPA for coating.
36 Spacer Counter Checker
Check the density of the spacer thur the PC ,if the density over the range NG product will move to NG buffer distrubition range setting can be set up in advance base on the product.
37 UV Spot Dispenser
UV resin dispense on the glass for position fixing. During alignment glass is easy to move.
38 Glass Alignment
Laminate the upper glass and Lower glass, by CCD system, first by low pressure align, second by high pressure align then F/R glass will assemblies as a set of Glass Panel (we call master glass).
39 Robot Separate Conveyor
Robot Separate Conveyor transport the F and R glass to the auto alignment machine, All the process control by Automatic Robot.
40 Hot Press Gap Forming
Format of Cell Gap by Compression method, Thermo method cure the seal epoxy in high temperature. Then Cell gap can be formed, sometime add up Interleaf sheet for thermo distribution.
41 Polarizor Laminator
Lamination of Polarizer on the LCD cell, rub the edge of the glass then wash then laminate the polarizer.
42 Module Bonding
Module process by COG (Chip on Glass) TAB (Tape Automatic bonding) or other method for PCB assembly module process.